de-tinning process
mchakato wa kuondoa tini
de-tinning bath
batia ya kuondoa tini
de-tinning solution
yeyusho la kuondoa tini
de-tinning line
mstari wa kuondoa tini
de-tinning waste
uchafu wa kuondoa tini
de-tinning agent
kikoa cha kuondoa tini
de-tinning metal
chuma cha kuondoa tini
de-tinning residue
mbaki ya kuondoa tini
de-tinning effectively
kuondoa tini kwa ufanisi
de-tinning quickly
kuondoa tini kwa haraka
the process of de-tinning solder joints is crucial for rework.
mchakato wa kuondoa tini ya viungo vya solder ni muhimu kwa ajili ya kurekebisha.
we use a specialized solvent for de-tinning circuit boards.
tunatumia kinyumbufu maalum kwa ajili ya kuondoa tini ya mabodi ya mzunguko.
careful de-tinning prevents damage to the underlying components.
kuondoa tini kwa uangalifu kunazuia uharibifu wa vipengele vya chini.
de-tinning is often necessary before component replacement.
kuondoa tini mara nyingi ni lazima kabla ya kubadilisha vipengele.
the de-tinning station efficiently removes excess solder.
kituo cha kuondoa tini huondoa solder zaidi kwa ufanisi.
proper ventilation is essential during the de-tinning process.
hewa nzuri ni muhimu wakati wa mchakato wa kuondoa tini.
we need to evaluate the cost-effectiveness of de-tinning.
tunahitaji kutathmini ufanisi wa gharama wa kuondoa tini.
the de-tinning fluid should be applied evenly to the joint.
kioevu cha kuondoa tini kinapaswa kutumika kwa usawa kwenye kiungo.
automated de-tinning systems improve production efficiency.
mifumo ya kuondoa tini ya kiotomatiki huongeza ufanisi wa uzalishaji.
thorough cleaning follows the de-tinning procedure.
usafi kamili unafuata utaratibu wa kuondoa tini.
de-tinning ensures a clean surface for new solder application.
kuondoa tini kuhakikisha uso safi kwa matumizi ya solder mpya.
de-tinning process
mchakato wa kuondoa tini
de-tinning bath
batia ya kuondoa tini
de-tinning solution
yeyusho la kuondoa tini
de-tinning line
mstari wa kuondoa tini
de-tinning waste
uchafu wa kuondoa tini
de-tinning agent
kikoa cha kuondoa tini
de-tinning metal
chuma cha kuondoa tini
de-tinning residue
mbaki ya kuondoa tini
de-tinning effectively
kuondoa tini kwa ufanisi
de-tinning quickly
kuondoa tini kwa haraka
the process of de-tinning solder joints is crucial for rework.
mchakato wa kuondoa tini ya viungo vya solder ni muhimu kwa ajili ya kurekebisha.
we use a specialized solvent for de-tinning circuit boards.
tunatumia kinyumbufu maalum kwa ajili ya kuondoa tini ya mabodi ya mzunguko.
careful de-tinning prevents damage to the underlying components.
kuondoa tini kwa uangalifu kunazuia uharibifu wa vipengele vya chini.
de-tinning is often necessary before component replacement.
kuondoa tini mara nyingi ni lazima kabla ya kubadilisha vipengele.
the de-tinning station efficiently removes excess solder.
kituo cha kuondoa tini huondoa solder zaidi kwa ufanisi.
proper ventilation is essential during the de-tinning process.
hewa nzuri ni muhimu wakati wa mchakato wa kuondoa tini.
we need to evaluate the cost-effectiveness of de-tinning.
tunahitaji kutathmini ufanisi wa gharama wa kuondoa tini.
the de-tinning fluid should be applied evenly to the joint.
kioevu cha kuondoa tini kinapaswa kutumika kwa usawa kwenye kiungo.
automated de-tinning systems improve production efficiency.
mifumo ya kuondoa tini ya kiotomatiki huongeza ufanisi wa uzalishaji.
thorough cleaning follows the de-tinning procedure.
usafi kamili unafuata utaratibu wa kuondoa tini.
de-tinning ensures a clean surface for new solder application.
kuondoa tini kuhakikisha uso safi kwa matumizi ya solder mpya.
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