de-tinning process
脫錫過程
de-tinning bath
脫錫槽
de-tinning solution
脫錫溶液
de-tinning line
脫錫線
de-tinning waste
脫錫廢料
de-tinning agent
脫錫劑
de-tinning metal
脫錫金屬
de-tinning residue
脫錫殘渣
de-tinning effectively
有效脫錫
de-tinning quickly
快速脫錫
the process of de-tinning solder joints is crucial for rework.
去除錫膏的過程對於返工至關重要。
we use a specialized solvent for de-tinning circuit boards.
我們使用專用溶劑來去除電路板上的錫膏。
careful de-tinning prevents damage to the underlying components.
仔細去除錫膏可避免損壞底層元件。
de-tinning is often necessary before component replacement.
在更換元件之前，通常需要去除錫膏。
the de-tinning station efficiently removes excess solder.
去除錫膏的工作站能有效去除過多的錫膏。
proper ventilation is essential during the de-tinning process.
在去除錫膏的過程中，適當的通風是必不可少的。
we need to evaluate the cost-effectiveness of de-tinning.
我們需要評估去除錫膏的成本效益。
the de-tinning fluid should be applied evenly to the joint.
去除錫膏的液體應均勻地塗抹在接合處。
automated de-tinning systems improve production efficiency.
自動化去除錫膏系統能提高生產效率。
thorough cleaning follows the de-tinning procedure.
去除錫膏程序後需進行徹底清潔。
de-tinning ensures a clean surface for new solder application.
去除錫膏可確保新錫膏應用的表面潔淨。
de-tinning process
脫錫過程
de-tinning bath
脫錫槽
de-tinning solution
脫錫溶液
de-tinning line
脫錫線
de-tinning waste
脫錫廢料
de-tinning agent
脫錫劑
de-tinning metal
脫錫金屬
de-tinning residue
脫錫殘渣
de-tinning effectively
有效脫錫
de-tinning quickly
快速脫錫
the process of de-tinning solder joints is crucial for rework.
去除錫膏的過程對於返工至關重要。
we use a specialized solvent for de-tinning circuit boards.
我們使用專用溶劑來去除電路板上的錫膏。
careful de-tinning prevents damage to the underlying components.
仔細去除錫膏可避免損壞底層元件。
de-tinning is often necessary before component replacement.
在更換元件之前，通常需要去除錫膏。
the de-tinning station efficiently removes excess solder.
去除錫膏的工作站能有效去除過多的錫膏。
proper ventilation is essential during the de-tinning process.
在去除錫膏的過程中，適當的通風是必不可少的。
we need to evaluate the cost-effectiveness of de-tinning.
我們需要評估去除錫膏的成本效益。
the de-tinning fluid should be applied evenly to the joint.
去除錫膏的液體應均勻地塗抹在接合處。
automated de-tinning systems improve production efficiency.
自動化去除錫膏系統能提高生產效率。
thorough cleaning follows the de-tinning procedure.
去除錫膏程序後需進行徹底清潔。
de-tinning ensures a clean surface for new solder application.
去除錫膏可確保新錫膏應用的表面潔淨。
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